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    Archived pages: 199 . Archive date: 2014-09.

  • Title: Georgia Tech | Cleanroom
    Descriptive info: .. Georgia Tech - Institute for Electronics and Nanotechnology | Cleanroom.. Log In.. Shared IEN Cleanrooms & Labs.. Home.. About Us.. Capabilities.. Safety.. Contact Us.. News.. Videos.. Rates.. Live Cameras.. Equipment Search.. Equipment Categories.. Fabrication Services.. MSDS Info.. E Mail Us.. Become A User.. It s easy to become a user and use our facilities.. Just follow this link to sign into our system and then attend an orientation.. Learn More.. Process Consultation.. Talk to our process experts for advice on your process using our tools.. The IEN has cleanroom and lab facilities which you can use to do your processing.. Have us do your processing!.. James Meindl Legacy Project.. For over twenty years the U.. S.. has been losing its competitive edge in producing trained workers for Science, Technology, Engineering and Math (STEM) careers.. We are deeply committed to uncover compelling stories that will engage youth to discover and invent the next great ideas to benefit mankind.. We want to help parents instill in their children the values needed to solve tomorrow’s problems with confidence and to choose careers that will provide meaningful career paths.. With your support, we will bring K-12 students into the real world of today’s young researchers who will use their laboratories at Georgia Tech to create “Teachable Moment” demonstrations.. Become a User.. Its easy to become a user and use our facilities.. Have us do your Processing.. Send us your samples and we can  ...   the Georgia Tech campus with a wide variety of processing and materials support along with the expertise of the IEN staff.. Proud Member of the NNIN.. The Georgia Tech Institute for Electronics and Nanotechnology is a proud member of the National Nanotechnology Infrastructure Network.. Controls Replacement Projects.. At the IEN we have replaced the controls systems on 12 pieces of semiconductor fabrication equipment.. This gives us the ability to create a new control system for a piece of equipment with an obsolete or failing control system.. By doing this we increase uptime of critical tools, reduce training time across tools, add any new features to the system we desire and have the ability to datalog and points on the tool to assist in staff troubleshooting and user documentation of processes.. Please contact Jason Herrington at jasonherrington@gatech.. edu if you would like more information on the controls projects or adding a feature to on of these tools.. Cleanroom.. The IEN has cleanrooms in the Pettit Microelectronics Research building and the Marcus Nanotechnology Research building.. Georgia Tech Institute for Electronics and Nanotechnology.. The Institute for Electronics and Nanotechnology (IEN) is a Georgia Tech interdisciplinary research institute designed to enhance support for rapidly growing research programs spanning biomedicine, materials, electronics and nanotechnology.. Visit Georgia Tech IEN.. Marcus Nanotechnology Research Center.. Georgia Institute of Technology.. 345 Ferst Drive NW.. Atlanta, GA 30318.. (404) 894-5100.. Pettit Microelectronics Research Building.. 791 Atlantic Drive.. Atlanta, Ga 30332..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: MEMS Certificate Program.. Aug.. 5, 2011, midnight - The schools of ECE, MechE, and ChBE begin certificate program in MEMS for graduate students.. An Effective Lift-Off Method for Patterning High-Density Gold Interconnects on an Elastomeric Substrate.. Nov.. 22, 2010, midnight - A 3 cm cable of ten gold wires with 10 um width and 20 um pitch is achieved, successfully demonstrating density increases of more than one order of magnitude from previously established work.. High-Density Stretchable Electronics: Toward an Integrated Multilayer Composite.. 23, 2010, midnight - Two major challenges associated with stretchable electronics-increasing integration density and improving electrical bonding-have been addressed by our innovative multilayer via-bonding technology.. Groundbreaking Research in Nanofluidics.. July 19, 2010, midnight - Engineers Devin Brown and Nicole Devlin at the NRC create nanometer scale channels in a controlled, repeatable, and preferable simple way.. Simultaneous Electrical and Mechanical Disruption of Cell Membranes Improves Transfection Efficiency.. March 15, 2010, midnight - OpenCell has developed and optimized a prototype device termed STEAM, which evolved from research into biomedical applications for novel micro-machined ultrasonic atomizers performed at Georgia Tech.. Thermo Scientific K-Alpha XPS.. March 8,  ...   a one-step graphene doping process, paving the way for commercial fabrication.. Packaging and Characterization of Mechanically Actuated Microtweezers for Biomedical Applications.. 5, 2010, midnight - This paper presents the successful design, fabrication, and packaging of a mechanically actuated micro-electro-mechanical-systems (MEMS) microtweezer.. NRC Acquires Powerful New Software or the JEOL JBX-9300FS.. Sept.. 29, 2008, midnight - New software will provide users with more accurate, robust, and uniform nanoscale patterning.. New X-Ray Tomography Tool Installed in NRC.. 10, 2008, midnight - The NRC has just installed a new tool, the Dage XD7600-NT, in Room 161 of the Pettit Microelectronics Research Center.. The FIB-Center at GT (FIB2) Moves to NRC.. 13, 2007, midnight - FIB-Center will become a visible component of the Microelectronics Research Center (MiRC), located in Pettit Room 160.. Nanoimprint Lithography Now Available at Georgia Tech.. 22, 2005, midnight - A NIL system was installed at the MiRC in July which enables a low-cost process of mass replication of nanoscale and microscale structures.. Nanolithography: JEOL JBX-9300FS E-beam Writer.. May 24, 2005, midnight - Now scheduling training sessions and taking samples for our new E-beam lithography tool..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Equipment Training.. AET RTP.. CEE Spinner.. Critical Point Dryer.. CVC E-Beam Evaporator.. Gasonics Asher.. Hitachi 3500H SEM.. JEOL JBX-9300FS EBL.. Lindberg Furnace.. Mask Cleaner.. Nanospec Refractometer.. Plasma-Therm PECVD.. Plasma-Therm RIE.. PVD75 Filament Evaporator.. RC8 Spin Coater.. STS PECVD.. Unaxis PECVD.. Woollam Ellipsometer.. Wyko Profilometer.. Cleanroom Safety.. Cleaning an Amber Bottle..  ...   or Non-Functional Devices.. Handling Equipment Malfunction.. Inorganic Cleanroom Gowning Procedure.. Labeling Chemicals.. Organic Cleanroom Gowning Procedure.. Sharp Objects and Chemical Spills.. Storage Procedures.. Submitting an MSDS.. Promo.. CVC E-Beam Evaporator Informational Video.. Hitachi S-3700N Electron Microscope.. Keyence VHX-600 Digital Microscope.. Marcus Nanotechnology Building.. NanoGrip Technlogies Promo.. Q-Sense E4 Promotional Video..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Our Rates.. on this page.. Direct Costs.. This is what we directly charge you, not including any overhead rates charged by the university.. Cleanroom Rates.. Rates for being inside a cleanroom.. All equipment that is not inside of a cleanroom are NOT charged any cleanroom fees.. You are only charged for hourly rate for the particular equipment (listed below).. US Academic Rate.. 1.. Foreign Academic/Industry Rate.. Pettit and Marcus Inorganic Cleanroom Entry Fee (includes Organic entry fee).. $200 per month.. $550 per month.. Marcus Organic Cleanroom Only Entry Fee (not charged if user enters Pettit or Marucs Inorganic Cleanroom in same month).. $100 per month.. Hourly Fee for All Cleanrooms.. $20 per hour (120 cap per quarter).. $20 per hour (no cap).. Hourly Equipment.. This equipment is billed on straight time.. Equipment.. Dage X-Ray XD7600NT (Lab - Pettit 161).. $20/hr.. $36/hr.. EAC Test Machine (Lab - Pettit 161).. $100/hr.. $300/hr.. FEI Nova Nanolab 200 FIB/SEM (Marcus Microscopy 1).. $45/hr.. $189/hr.. FEI Quanta 200 3D FIB/SEM (Lab - Pettit 1st Floor).. Finetech Sub-micron Flip-chip Bonder (Lab - Pettit 248).. $35/hr.. FTIR Spectrometer (Marcus Microscopy 2).. Hermes LS500XL CO2 laser (Bunger Henry Laser Lab).. Hitachi HT7700 TEM (Marcus Microscopy 1).. Hitachi SU8230 (Marcus Microscopy 4).. Hummer 6 Gold/Palladium Sputterer (Marcus Microscopy 1).. Hysitron TriboIndenter (Marcus Microscopy 2).. $82/hr.. IONTOF Time-of-Flight SIMS (Marcus Microscopy 1).. $150/hr.. JEOL JBX-9300FS EBL System (Cleanroom - Pettit).. $110/hr.. Keyence VHX-600 Digital Microscope (Marcus Microscopy 2).. $39/hr.. Kratos XPS (Marcus Microscopy 2).. Logitech LP50 Lapper (Lab - Marcus Lapper Polishing Room).. $5/hr.. $10/hr.. Logitech PM5 Polisher 1 (Lab - Marcus Lapper Polishing Room).. Optec /Coherent LPX210i UV laser (Bunger Henry Laser Lab).. Pananalytical XRD (Lab - Pettit 248).. Raman Spectrometer (Marcus Microscopy 2).. Resonetics IR laser (Bunger Henry Laser Lab).. SCS Parylene Labcoater (Lab - Pettit 248).. $40/hr.. Thermo K-Alpha XPS (Marcus Microscopy 2).. Veeco AFM (Marcus Microscopy 1).. Veeco AFM II Dimension 3100 (Marcus Microscopy 2).. Zeiss Ultra60 FE-SEM (Marcus Microscopy 3).. $103/hr.. Equipment Always Billed.. For the tools listed below, you will always be charged the cleanroom hourly rate when you are logged into the tool, even if you are not logged into a cleanroom.. And remember, you will only be charged the cleanroom rate for one tool, even if you are logged into multiple tools.. Location.. Cleanroom - Pettit.. ALD1.. Cleanroom - Marcus Inorganic.. ALD2.. Biacore T200 SPR.. Cleanroom - Marcus Organic.. Bioforce Nano eNabler Printer/Patterner.. Black Magic PECVD.. Cambridge NanoTech Plasma ALD - Metal (left).. Cambridge NanoTech Plasma ALD - Oxide (right).. CHA E-beam Evaporator 1 (dielectrics).. CHA E-beam Evaporator 2 (metals).. Contact Angle Measurement System.. CVC DC Sputterer.. CVC E-Beam Evaporator 1.. CVC E-Beam Evaporator 2 -- Instructional Center.. CVD FirstNano SiGe Nanowire Furnace.. Denton Discovery - RF/DC Sputterer.. Denton Explorer - E-beam Evaporator.. Hitachi S-3700N VP-SEM.. Hitachi S-4700 FE-SEM.. Hummer 5 Gold/Palladium Sputterer.. JetFirst RTP.. JetLabII Ink-jet Printer.. Karl Suss SB6 Bonder.. LEO 1530 FE-SEM.. Lindberg Furnace 1 (CMOS Sintering Tube).. Lindberg Furnace 2 (Polymer Curing Tube).. Lindberg Furnace 3 (Oxidation Tube).. Lindberg Furnace 4 (Polymer Curing Tube).. Malvern Zetasizer.. Oxford Cryogenic ICP.. Oxford End-point  ...   deposits + $60 per.. 5.. Consultation.. $52 per hour.. Mask Shop.. Contact.. contact us.. for quote on mask shop work.. Mask design services billed as needed at $60 per hour.. Free quotes are provided before any work is completed.. Contact Print.. $60.. Photo Mask Production.. $90+$30/hour.. Electron Beam Laboratory.. Staff operation or technical consultation is billed as needed at $100 per hour (effective 6/1/2014).. CMOS Fab Runs.. Fab Run costs are computed on a case-by-case basis.. Please.. for further information.. Overhead Costs.. The current fiscal year Facilities & Administrative (F&A) and Fringe Benefits rates (a.. k.. a.. overhead or indirects) can be found at.. http://www.. osp.. gatech.. edu/rates/.. Rate Examples.. The following are examples of charges for only being inside of a cleanroom.. These examples do not include any equipment time, just how a user is charged for entering the cleanroom(s).. Lab equipment is only billed at the hourly rate.. Some equipment (as noted above) that is located in a cleanroom is always billed the hourly cleanroom rate of $20 per hour, even if you are not physically inside of the cleanroom.. Example 1: Marcus Inorganic and Pettit Cleanrooms Only.. User uses the cleanrooms for 40 hours over the course of 1 month.. US Academic.. Foreign Academic/Industry.. Entry Fee.. $200 * 1 months = $200.. $550 * 1 months = $550.. Hourly Fee.. $20 * 40 hours = $800.. Total Direct Cost.. $1000.. $1350.. Example 2: Marcus Inorganic and Pettit Cleanrooms Only.. User uses the cleanrooms for 40 hours over the course of 3 months.. $200 * 3 months = $600.. $550 * 3 months = $1650.. $1400.. $2450.. Example 3: Marcus Inorganic and Pettit Cleanrooms Only.. User uses the cleanrooms for 140 hours over the course of 2 months.. $200 * 2 months = $400.. $550 * 2 months = $1100.. $20 * 120 hours (due to cap) = $2400.. $20 * 140 hours = $2800.. $2800.. $3900.. Example 4: Marcus Organic Cleanroom Only.. User uses the organic cleanroom for 140 hours over the course of 3 months.. $100 * 3 month = $300.. $2700.. $3100.. Example 5: Marcus Organic Cleanroom Only.. User uses organic cleanroom for 30 hours over the course of 1 month.. $100 * 1 month = $100.. $20 * 30 hours = $600.. $700.. Example 6: Use of All Cleanrooms.. User uses the organic cleanroom only for 30 hours over the course of 1 month (September) and the inorganic cleanrooms for 50 hours in 2 other months (October and November).. $100 * 1 month + $200 * 2 months = $500.. $100 * 1 month + $550 * 2 months = $1200.. $20 * 80 hours = $1600.. $2100.. Example 7: Use of All Cleanrooms.. User uses the organic cleanroom only for 30 hours over the course of 1 month (June) and the inorganic cleanrooms for 50 hours in 3 other months (June, July, August).. $200 * 3 months (organic entry waived) = $600.. $550 * 3 months (organic entry waived) = $1650.. $2200.. $3250.. US Academic rates include users from Georgia Tech, external academic institutions, and government labs..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Cameras.. Pettit Cleanroom.. Bay 1.. Bay 1 Fume Hood.. Bay 2.. Bay 2 Fumehood.. Bay 3.. Bay 3 Fumehood.. Bay 4 Fumehood.. Bay 5.. Bay 5 Fumehood.. Bay 6.. Bay 6 Fumehood.. Entrance.. Gowning Room.. Hall Left.. Hall Right.. Instructional 1.. Instructional 2.. Instructional Hall.. JEOL 1.. JEOL  ...   Marcus Inogranic Cleanroom.. Column 2 North.. Column 3 East.. Column 3 North.. Fume Hood 1.. Fume Hood 2.. Fume Hood 3.. Fume Hood 4.. Plating Hood.. Solvent Fumehood.. Marcus Organic Cleanroom.. Gowning.. Suite 1.. Suite 2.. Suite 3.. Suite 4.. Suite 5.. Suite 6.. Marcus Building.. Lapper Polisher..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: None.. 2nd Floor Computer Lab.. GEDC.. Lab - Marcus Lapper Polishing Room.. Lab - Pettit 1st Floor.. Lab - Pettit 161.. Lab - Pettit 165.. Lab - Pettit 248.. Lab - Pettit Cleanroom Focus Center.. -.. Bunger Henry Laser Lab.. Assembly Lab.. Pettit Staff Office.. PRC cleanroom.. Marcus Microscopy 1.. Marcus Microscopy 2.. Marcus Microscopy 3.. Marcus Microscopy 4.. Categories / Features.. Dielectrics Deposition - Alumina.. Dielectrics Deposition - Erbium Oxide.. Dielectrics Deposition - Hafnia.. Dielectrics Deposition - Silica.. Dielectrics Deposition - Titania.. Dielectrics Deposition - Zinc Oxide.. Dielectrics Deposition - Zirconia.. Metal Deposition - Platinum.. Nitride Deposition - Aluminum Nitride.. Nitride Deposition - Hafnium Nitride.. Nitride Deposition - Silicon Nitride.. Nitride Deposition - Titanium Nitride.. Nitride Deposition - Zirconium Nitride.. Aluminum Oxide.. Biological.. Deposition - Carbon.. Dielectrics Deposition - Diamond Like Carbon.. Dielectrics Deposition - RF Sputterer Dielectrics.. Dielectrics Deposition -  ...   - Ruthenium.. Metal Deposition - Silver.. Metal Deposition - Tanatalum.. Metal Deposition - Tin.. Metal Deposition - Titanium.. Metal Deposition - Tungsten.. Poymer.. Silicon.. Thin Films.. Titanium Oxide.. Zinc Oxide.. Copper.. Dielectrics - Gallium Nitride.. Dielectrics - Indium Phosphide.. Dielectrics - Silicon Nitride.. Dielectrics - Silicon Oxide.. Dielectrics - Zinc Sulfide.. Etch - Quartz.. Metals - Aluminum.. Metals - Chrome.. Polymer - Photoresist.. Polymer - Polyimide.. Quartz.. Semiconductor.. ALD Systems.. Characterization.. Evaporator Systems.. Graphene/SiGe Systems.. ICP Systems.. Mask Aligner Systems.. PECVD Systems.. RIE Systems.. SEM Systems.. Specialty Bonder/Spray Coater Systems.. Sputterer Systems.. Tystar Furnace Systems.. XPS Systems.. Substrate Size - 2 in wafer.. Substrate Size - small pieces.. FESEM.. E-Beam Nanolitography.. Mask Alignment.. Pattern Generation.. Spin Coating.. Film Thickness.. Film Uniformity.. Imaging.. Optical Properties.. Particle Size.. Surface Properties.. Zeta Potential.. Backend.. Radioactive.. Diffusion.. Film Growth.. Materials Growth.. Wet Processing.. Keywords.. Search by Category..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Equipment Classification.. ALD.. The Atomic Layer Deposition (ALD) tool is used to deposit atomic layers of material.. The ALD uses 2.. Details.. This ALD uses 4.. The Cambridge Fiji Plasma ALD system uses ALD precursors to deposit pin-hole free films in ultra-hig.. Deposition.. The Nano eNabler is a multifunctional surface patterning platform for dispensing attoliter to femtol.. The e-beam evaporator will provide very little coating to the sides of any features that are perpend.. The DC sputterer is used to coat samples with metals.. Metal coatings are usually performed with this.. The e-beam evaporator is used to coat samples with various metals.. Unlike sputtered films, evaporato.. Configured for thin film deposition of up to 4 materials sequentially without breaking the vacuum.. T.. Denton Infinity.. Denton Infinity - ebeam and filament evaporator.. This table-top ink-jet microdispensing and printing platform is useful for a wide variety of applica.. The filament evaporator is used to coat samples with various metals.. The PVD is a good choice for sa.. The RF sputterer can be used to deposit many dielectrics.. Coatings are performed by accelerating io.. PVD Filament Evaporator (Instructional Lab).. PVD Filament Evaporator in the Pettit Instructional Lab.. SCS Parylene Labcoater.. The SCS Labcoter PDS 2010 is a vacuum system used for conformal vapor deposition of Parylene at room.. A PECVD (Plasma Enhanced Chemical Vapor Depositor) process reacts gases in a RF (radio frequency) in.. Sulfurization furnace.. The sulfurization furnace is used to deposit sulfur at high temperatures.. The tool is setup to injec.. The Tystar Nitride Furnace 4 is used for LPCVD silicon nitride, including stoichiometric silicon nit.. The Unifilm Multisource Sputtering System deposits thin metal films in a argon-enriched low vacuum.. Etch.. The Aura 1000 Asher is a microprocessor controlled downstream photoresist stripper that will strip t.. Gasonics Asher (Inorganic).. The Aura 1000 Asher is a microprocessor controlled downstream, or afterglow , photoresist stripper.. Hydrofluoric (HF) Vapor Etcher.. The Hydrofluoric Vapor Etcher is used for the removal of oxide layers on samples.. It has high etch r.. The Oxford Cryogenic ICP (Inductively Coupled Plasma) etching (DRIE) produces high ion densities a.. An Oxford Endpoint RIE (Reactive Ion Etcher) system is designed to etch materials such as SiO2 and S.. An ICP (inductively coupled plasma) etcher (DRIE) can be used to etch a variety of materials.. This I.. RIEs (Reactive Ion Etcher) are used to etch various materials, such as semiconductors, polymers, and.. The Advanced Oxide Etch (AOE) source is a revolutionary design, based on STS well-established Induc.. STS HRM ICP.. The STS HRM is a CMOS-Compatible tool used for integrated MEMS-CMOS processes, and is meant for narr.. The STS ICP is a CMOS-compatible tool used for integrated MEMS-CMOS processes, and is meant for narr.. The STS Pegasus ICP is a deep reactive ion etcher (DRIE) with a dual plasma source design.. It is des.. STS SOE system combines a high conductance, high vacuum compatible process chamber with a patented I.. Unaxis RIE.. The Vision 320 RIE is a manually loaded Reactive Ion Etcher plasma system.. It is used to etch dielec.. This tool uses xenon difluoride gas sent through a showerhead to isotropically dry etch silicon, ger.. General Equipment Specification.. General Equipment Specification (old).. Graphene.. SiGe Nanowire Furnace.. Imaging.. FEI Nova Nanolab 200 FIB/SEM.. The Nova Nanolab is designed to be a complete nanotechnology laboratory in one tool.. It combines ult.. FEI Quanta 200 3D FIB/SEM.. The Quanta 3D is designed to be a 3D-SEM.. It combines traditional thermal emission Scanning Electron.. Hitachi HT7700 TEM.. The HT7700 is a highly advanced Transmission Electron Microscope developed for imaging both biologic.. Hitachi S-3500H SEM.. The Hitachi 3500H series scanning electron microscope offers high resolution imaging in a vacuum.. The Hitachi S-3700N Variable Pressure SEM features a low vacuum observation of 6–270 Pa (7mT-2Torr).. The Hitachi S-4700 FE-SEM is a cold field emission high resolution scanning electron microscope.. Thi.. The LEO 1530 FE-SEM is a hi-resolution SEM capable of sub-nanometer resolution.. Detectors: In-L.. Zeiss Ultra60 FE-SEM.. The Zeiss scanning electron microscope is the instrument of choice for clear and precise imaging on.. Lithography.. BLE Spinner.. The BLE Photoresist Spinner is a spinner/hot plate combo mounted inside of a white polypropylene b.. EVG 101 Spin Coater.. The EVG101 Spin Coater is a teflon body, automatic Shipley 1827 resist spin coater.. It offers furthe.. EVG 620 Mask Aligner.. The EVG 620 Mask aligner is configured for top and backside alignment.. It has a manual cassette load.. Karl Suss MA-6 Mask Aligner (Marcus).. Mask aligners are used in photolithographic processes to transfer a pattern from a mask to a photore.. Karl Suss MA-6 Mask Aligner (Pettit).. Karl Suss RC8 Spinner (Marcus).. The RC8 programmable process spinner is reserved for photoresist use.. Spin coatings of other materi.. Karl Suss  ...   to be used.. BGA Rework Station.. This tool is used to rework soldered flip chips.. It has rough alignment and placement capabilities.. Dage Shear Tester.. The Dage Shear Tester is used primarily to test flip chip bonds by shearing off the bonded die.. Finetech Sub-micron Flip-chip Bonder.. The Finetech Fineplacer Lambda is a very high precision flip-chip bonder that has the following feat.. K S 4522 Ball Bonder.. Semi automatic gold ball wire bonder.. Currently set up with 25 um gold wire with a ball size of abo.. K S 4523A Wedge Wire Bonder.. Aluminum wire wedge bonder.. Provides digital controls with semiautomatic bonding cycle, but manual.. Manual Flip Chip Bonder.. This flip chip bonder is currently only for PRC use.. It can perform thermocompression, thermosonic,.. MEI ball bonder.. Gold Ball bonder - Manual.. Peel Tester.. The TMI Peel Tester performs 90 and 180 Degree peel test strength measurements for laminates and adh.. Quick Circuit 7000 PCB Milling Machine.. The PCB mill can be used to cut out shapes in FR4 material and be used for routing PCB s and drillin.. SEC 850 Flip-chip Bonder.. The SEC850 is an easy-to-use manual flip-chip bonding/placement system.. The placement accuracy of th.. Semiautomatic Screen Printer.. Semiautomatic Screen Printer for depositing solder paste and similar materials.. Screens must be des.. Solder Reflow Oven.. 5 zone reflow oven with inert atmosphere for oxidation-free soldering.. PECVD Growth Systems.. AIXTRON’s PECVD system uses rapid heating and plasma technologies that have been proven in the field.. The Oxford ICP (Inductively Coupled Plasma) PECVD deposits a high-density, thin film under low tempe.. Oxford PECVD left.. A PECVD (Plasma Enhanced Chemical Vapor Depositor) reacts gases in a RF (radio frequency) induced pl.. Oxford PECVD right.. Spin Coating.. Thermal Processing.. Rapid thermal processors (RTP) or rapid thermal annealers (RTA) are used to rapidly heat a sample fo.. CVD FirstNano Graphene Furnace.. The CVD FirstNano Graphene Furnace has the following features: -quartz chamber with graphite susc.. Heraeus Vacuum Oven (Marcus).. The Heraeus Vacuum Oven used for heating of substrates under 5-10 milliTorr Vacuum - up to 350C unde.. Heraeus Vacuum Oven (Pettit).. The JetFirst RTP system is a rapid temperature processing system for up to 4 wafers.. Specs: -ra.. The Lindberg furnaces are used for curing polymers, sintering, and growing oxides and nitrides on si.. The Lindberg furnaces are used for curing polymers, sintering, and wet/dry oxidation and nitrides on.. Mini Tystar Tube 1.. Marcus Inorganic Mini Tystar 1 is primarily used for wet oxidation at temperatures between 700-1100°.. Mini Tystar Tube 2.. Marcus Inorganic Mini Tystar 2 is used for dry and wet oxidation at temperatures between 700-1100°C.. Mini Tystar Tube 3.. Marcus Inorganic Mini Tystar 3 is used for low temperature oxidation (LTO) at 725°C and pressure of.. Mini Tystar Tube 4.. Marcus Inorganic Mini Tystar - bottom tube (no tube at the moment).. MRL Furnace - Tube 1.. MRL Furnace - Tube 2.. MRL Furnace - Tube 3.. MRL Furnace 3 is used for dry oxidation at temperature between 700-1150°C.. Batches of up to 50 wafers.. MRL Furnace - Tube 4.. MRL Furnace 4 is used for annealing only at temperature between 700-1150°C with batches of up to 50.. SSI RTP.. The SSI RTP system is a rapid temperature processing system for up to 4 wafers.. Specs: -max.. al.. Tystar Nitride Furnace.. TYTAN Furnace systems can be used for all conventional atmospheric and low-pressure CVD processes em.. The Tystar Nitride Furnace 1 is used for N-type doping, Polysilicon doping (N-type) with solid (Phos.. The Tystar Nitride Furnace 2 is used for P-type doping, Polysilicon doping (P-type) with solid sourc.. The Tystar Nitride Furnace 3 is used for Padox, Well, Field (LOCOS) oxide, wet oxidation growth.. The Tystar Poly Furnace 1 is used for LTO/implantation anneal.. The Tystar Poly Furnace 2 is used for Kooi, P-well drive, and dry, and wet oxidation.. The Tystar Poly Furnace 3 is used for polysilicon (undoped and N doped) deposition at a low pressure.. The Tystar Poly Furnace 4 is used for polysilicon (undoped and P doped) deposition at a low pressure.. Tystar Polysilicon Furnace.. Wet Bench Processing.. CMOS Cleaning Station (Marcus).. This fume hood has heated tanks: Piranha, SC1, SC2 cleans and Nitride etch tank.. These wet baths a.. CMOS Cleaning Station (Pettit).. CMOS Spin Rinse Dryer (Inorganic).. Spin Rinse Dryer (SRD) is used for rinsing and drying full sized wafers in cassette, after cleaning.. CMOS Spin Rinse Dryer (Pettit).. The spin-rinse-dryer is equipped for cleaning four-inch silicon wafers.. It spins the wafers and uses.. MEMS Wet Bench.. MEMS wet bench.. Semitool Spin Rinse Dryer -- Instructional Center.. Verteq Spin Rinse Dryer -- Instructional Center.. The Verteq spin rinse dryer is a drying system that uses centrifugal forces to dry the surface of a..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Processing.. Info.. Overview.. Information about substrate cleaning, deposition, doping, etching, mask design, lithography, thermal processing, and metrology.. Processing Modules.. These modules are standardized procedures for various tasks accomplished in the cleanroom.. Each module consists of list of necessary supplies and the procedures that should be followed during that processing step.. We have also tried to include common mistakes and questions about each processing step.. These procedures should help with repeatability in our facility and help you standardize your process.. Both new and old users show find this information useful.. Chemicals Supplied.. Chemicals that are provided to all users.. CMOS Group.. CMOS services provided by the group including oxidations, nitridations,  ...   by the manufacturers for use in their processing tools.. Georgia Tech access only.. Temporary Processing Library.. This is a temporary website for Georgia Tech IEN Cleanroom processing library.. Users can find the standard recipes, operation procedures, and updated baseline information.. Users are welcome to use it and give us some feedback.. Build Your Process.. Start building your processes.. External Links.. Diffusion Thickness Calculator.. A third-party silicon thermal oxide thickness calculator.. Cleanroom Technical Seminar Slides.. Deposition of Dielectrics.. Deposition of Metals.. Photolithography.. Reactive Ion Etching.. Other Docs.. Metal Etchant Reference.. NNIN RET Data Summary.. NNIN RET 2007 Baseline Testing.. NNIN RET 2007 ICP Selectivity Profiling.. Selective Etchant Reference.. Sample Process Flow..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Chemicals.. If you cannot find a chemical on this page, you must first.. submit an MSDS.. before you can bring it into our buildings.. Filter by First Character.. all |.. 0.. |.. 2.. 3.. 4.. 5.. 6.. 7.. 8.. 9.. a.. b.. c.. d.. e.. f.. g.. h.. i.. j.. k.. l.. m.. n.. o.. p.. q.. r.. s.. t.. u.. v.. w.. x.. y.. z.. Filter by Chemical Type.. acid.. base.. buffer.. developer.. epoxy.. etchant.. gas.. hydrocarbon.. inorganic.. metal.. metal; other.. organic.. organic; solvent.. other.. photoresist.. polymer.. polymer; solvent.. salt.. solvent.. Chemical.. Supplied.. CAS Number.. 1112a remover.. no.. 112-34-5; 34590-94-8; 111-76-2; 98-.. MSDS.. Wikipedia.. print label.. 11-mercaptoundecanoic acid.. 71310-21-9.. 1,2,3-trichloropropane.. 96-18-4.. 1,2,4-trichlorobenzene.. 120-82-1.. 1,2-dichlorobenzene.. 95-50-1.. 1,3,5-trimethylbenzene.. 108-67-8.. 1-chloro-4-propoxy-9h-thioxanthen-9-one.. 142770-42-1.. 1-methoxy-2-propanol acetate.. 108-65-6.. 1% xr-1541.. 108-10-1; 137125-44-1.. 2,2,4 -trimethylpentane, anhydrous.. 540-84-1.. 2,2-dimethoxy-2-phenylacetophenone.. 24650-42-8.. 2-(2-pyridinyldithio)ethaneamine hydrochloride.. 83578-21-6.. 2,4-diethyl-9h-thioxanthen-9-one.. 82799-44-8.. 2-aminopropyltrimethoxysilane.. 13822-56-5.. 2-butoxyethyl acetate.. 112-07-2;.. 2-ethyl-9,10-dimethoxyanthracene.. 26708-04-3.. 2-heptanone.. 110-43-0.. 2-methoxyethanol.. 109-86-4.. 2-propanol.. yes.. 67-63-0.. 2% xr-1541.. 3000 fixer//replenisher.. 7783-18-8; 126-96-5; 631-61-8; 144-.. (3,3,3-trifluoropropyl)dimethylchlorosilane.. 1481-41-0.. 3-amino-1,2,4 triazole.. 61-82-5.. 3-aminopropyl functionalized silica.. 3-aminopropyltriethoxysilane.. 919-30-2.. 3m developmental material eas-1735 (experimental).. 25068-38-6; 5026-74-4.. (3-mercaptopropyl)trimethoxysilane.. 4420-74-0.. 495 pmma series resists in anisole.. 100-66-3, 9011-14-7.. 4-chloro 1-naphthol.. 604-4-44.. 6-azidosulfonylhexyltriethoxysilane.. 96550-26-4.. 6% xr-1541.. 92-023 primer.. 142-82-5; 2551-83-9; 5593-70-4.. 950 pmma a11.. 100-66-3; 9011-14-7.. 950 pmma a2.. 950 pmma a4.. 950 pmma a6.. 950 pmma a7.. 950 pmma series resist in anisole.. 100-66-3.. 9-anthracenemethanol.. 1468-95-7.. Accuglass 512b.. 64-17-5; 67-63-0; 67-64-1.. Accura si 50.. Accuspin 418.. Acetic acid.. 64 - 19 - 7.. 64-19-7.. Acetone.. 67-64-1.. Acetylene.. 74-86-2.. Acrylamide/bis-acrylamide, 40% solution.. 79-06-1; 110-26-9.. Adipic acid.. 124-04-9.. Air, compressed.. 132259-10-0.. Aluminum etchant type a.. 7664-38-2; 7697-37-2; 64-19-7.. Aluminum etchant type d.. 7664-38-2; 127-68-4; 64-19-7.. Ammonia.. 7664-41-7.. Ammonium acetate.. 631-61-8.. Ammonium chloride.. 12125-02-9.. Ammonium flouride.. 12125-01-8.. Ammonium hydroxide.. 1336-21-6.. Ammonium sulfide, 40-48 wt.. % solution in water.. 12135-76-1, 7732-18-5.. Amyl acetate.. 628-63-7.. Anhydrous hydrogen fluoride.. 7664-39-3, 110-86-1.. Anisole.. Ap200.. Ap3000 adhesion promoter (xu 35113.. 00).. 107-98-2.. Apx-k1.. Aquanox a4651us cleaning agent.. Aquasave-53za.. 67-65-0; 7732-18-5.. Argon.. 7440-37-1.. Argon-oxygen mixture.. 7440-37-1; 782-44-7.. Ascorbic acid.. 50-81-7.. A thinner.. Avatrel 1000 developer.. 5989-27-5; 111-82-0.. Avatrel 2000p dielectric polymer.. Avatrel 2090p.. Avatrel 2580-20 polymer.. Avatrel 2580-40 polymer.. 110-43-0; 108-88-3.. Avatrel7584p photodefinable polymer.. Avatrel ep m dielectric polymer.. Az 125nxt-10a.. Az 1915 in photoresist.. 108-65-6; 117520-84-0; 5610-94-6.. Az 300 mif developer.. 75-59-2; 7732-18-5.. 7732-18-5; 75-59-2.. Az 312 mif developer.. Az 327 mif developer.. 7732-18-5; 79-55-2; 2235-54-3.. Az 3312 resist.. 108-65-6; 97-64-3.. Az 400k developer.. 7732-18-5; 20786-60-1.. Az 400t photoresist stripper.. 872-50-4; 57-55-6; 75-59-2.. Az40xt-11d photoresist.. Az 5214 photoresist.. Az 9620 photoresist.. 108-65-6; 52125-43-6.. Az aquatar-iii-45.. 7732-18-5.. Az ebr70/30.. Az exp p4903 photoressist.. 108-65-6 ; 117520-84-0.. Az exp plp 100xt photoresist.. 107-98-2; 108-65-6.. Az kwik strip remover.. Az nlof 2070 photoresist.. Az p4110 photoresist.. 108-65-6; 117520-84-0.. Az p4210 photoresist.. Az p4400 photoresist.. Az p4620 photoresist.. Az(r) 1512 photoresist.. 108-65-6, 68510-93-0, 117520-84-0.. Az(r) exp ax(tm) 1020p photoresist.. B155 polyboron spin on dopant.. Baytron p vp al.. 155090-83-8.. Benzoic acid.. 65-85-0.. Benzyl alcohol.. 100-51-6.. Bioact ec-7r.. Bismuth.. 7440-69-9.. Bisphenol a dimethacrylate.. 3253-39-2.. Bisphenol a ethoxylate.. Bisphenol a ethoxylate (2 eo//phenol) diacrylate.. 64401-02-1, 108-88-3.. Bisphenol f diglycidyl ether.. 2095-03-6.. Bis(trimethoxysilyl)hexane.. 87135-01-1.. Borax.. Boric acid.. 10043-35-3.. Borofilm 100.. Boron dopant coating bdc1-2000.. 71-36-3.. Boron trichloride.. 10294-34-5.. Bpr 100 photoresist.. Bpr developer.. 50-21-5; 7732-18-5.. Bpr stripper.. 872-50-4.. Bpr thinner.. Bts 220.. Bts 220 edge bead remover.. Buffered formalin.. 7732-18-5; 50-00-0.. Buffered oxide etch 6:1.. Buffer ph 1.. 68.. 6100-20-5.. Butyl acetate.. 123-86-4.. Butyl ethyl ether.. 628-81-9.. Ca-40bn.. 34590-94-8; 112-15-2.. Cabot conductive ink 300.. Carbon dioxide.. 124-38-9.. Carbon tetrachloride.. 56-23-5.. Cerium (iv) ammonium sulfate dihydrate.. 10378-47-9.. Chem.. CAS.. Chlorine.. 7782-50-5.. Chlorobenzene.. 108-90-7.. Chloroform.. 67-66-3.. Chloroform, 1% in nitrogen.. Chloroform, anhydrous.. Chrome etch.. 16774-21-3; 7697-37-2.. Chrome etchant.. Chromium cermet etchant tfe.. 13746-66-2, 1310-73-2, 7732-18-5.. Chromium etch.. 7647-01-0; 56-81-5.. Chromium etch 1020 ac.. 16774-21-3; 64-19-7.. Chromium etchant type 1020.. Chromium trioxide.. 1333-82-0.. Citric acid.. 77-92-9.. Clevios ph-1000.. Cobalt acetate.. 71-48-7.. Cobalt chloride.. 7791-13-1.. Cobalt(ii) acetate tetrahydrate.. 6147-53-1.. Collagen calf skin.. 9007-34-5.. Colloidal gold.. 7440-57-5.. Contrad 70.. 1310-58-3.. Cool grease 7016.. 11043-11-5;.. Copper etchant 49-1.. 5949-29-1, 7722-84-1, 1336-21-6, 13.. Copper etch aps-100.. 7727-54-0.. Coppergleam.. 7664-93-9.. Copper gleam 125 additive.. 7732-18-5; 67-56-1.. Copper gleam 125 ex carrier.. 7732-18-5; 7758-98-7.. Copper (ii) sulfate pentahydrate (ca.. 100%).. 7758-99-8.. Copper sulfate.. Cr-100 chromium etch.. 1310-73-2; 7722-64-7; 7732-18-5.. Cr-14s chromium etchant.. 16774-21-3; 64-19-7; 7732-18-5.. Cr-7s chromium etchant.. 7732-18-5; 16774-21-3; 7601-90-3.. Crystalbond 509.. 25610-19-9.. Cupric chloride, dihydrate.. 10125-13-0.. Cupric sulphate.. 7758-98-7.. Cuprostar lp-1.. 7732-18-5.. Cus3116b.. 1344-28-1.. Cyanoborohydride coupling buffer.. Cyclic olefin copolymer.. 26007-43-2.. Cyclohexane.. 110-82-7.. Cyclopentanone.. 120-92-3.. Cyclotene 3022-35.. 124221-30-3; 108-67-8.. Cyclotene 3022 - 35 advanced electronics.. 124221-30-3; 108-67-8; 26780-96-1.. Cyclotene 3022-46.. Cyclotene 3022 - 46 advanced electronics resin.. Cyclotene 3022-57.. Cyclotene 3022-63.. Cyclotene 4022-35.. Cyclotene 4024-40.. Cyclotene 4026-46.. Cytop ctl-809m.. Cytop ct-solv180.. 311-89-7.. D-4000 liquid developer concentrate.. 7732-18-5; 584-08-7.. Da-6534 adhesive.. 7440-22-4; 68037-59-2.. De9040.. 107-98-2; 872-50-4.. Deuterated ammonia.. 13550-49-7.. Developer ds3000.. 717-74-8; 948-32-3; 15181-13-2.. Dichloromethane.. 75-09-2.. Dichlorosilane.. 4109-96-0.. Di(ethylene glycol) dimethacrylate.. 2358-84-1.. Diethyl phthalate.. 84-66-2.. Diiodomethane.. 200-841-5.. Dimethoxydimethylsilane.. 1112-39-6.. Dimethylformamide.. 68-12-2.. Dimethyl sulfoxide.. 67-68-5.. Diphenyldimethoxysilane.. 6843-66-9.. Disclean.. Dithiothreitol (1m).. Dow corning 7920 die attach adhesive.. 68037-59-2.. Ds2100 advanced development system.. 111109-77-4; 064742-48-9.. Duimide 7520.. 872-50-4; 109-17-1.. Durimide 7310es.. Durimide 7320es.. Durimide 9005.. Dynasolve 210.. 75-09-2; 27176-87-0.. Dysprosium.. 7429-91-6.. Eagle nt-90 photoresist.. Ebr-p general purpose edge bead remover.. Ebr pg positive radiation resist edge bead remover.. Eccoat uv-7993.. Ecoclear non-solvent cleaning fluid.. Edta.. 7732-18-5; 60-00-4.. Ekc-265.. 929-06-6; 7803-49-8; 120-80-9.. Electroless nickel plating ammonia type (enpat).. 3012-65-5;7718-54-9.. Elevate cu 6320 carrier.. Elevate cu electrolyte 20.. Emulsitone.. Enestra optical encapsulant xp 6010.. Epiclon 1121n-80m.. 31942-06-0; 78-93-3.. Epiclon n-690-75m.. 29690-82-2; 78-93-3.. Epoch c8902.. Epon resin 828.. 25068-38-6.. Epo-tek 301-2fl, part a.. 1675-54-3; 25085-99-8.. Epo tek 377, part a.. 025085-99-8; 2425-79-8.. Epo tek b9073-4.. 6837-24-7.. Epo-tek h21d.. 7440-22-4; 28064-14-4.. Epo tek k5022-115be.. 7440-22-4; 124-17-4.. Epo tek ma5.. 000107-98-2, 29690-82-2.. Espacer 300z.. Ethanol.. 64-17-5.. Ethyl alcohol.. Ethylene.. 74-85-1.. Ethylene glycol.. 107-21-1.. 110-80-5.. Ethylene glycol butyl ether.. 111-76-2.. Ethylene glycol monoethyl ether.. Ethyl l lactate.. 97-64-3.. Experimental waveguide core material.. 75-9-2.. Fe-12cc11 iron oxide etchant.. 7647-01-0, 7758-94-3.. Ferric chloride.. 7705-08-0; 7647-01-0.. Ferric trichloride hexahydrate.. 7705-08-0.. Ferrous chloride.. 7758-94-3.. Ferrous sulfate.. 13463-43-9.. Flip chip flux fc-ws-lt-b.. Fluoboric acid.. 7732-18-5; 16872-11-0.. Fluorine..  ...   developer.. 96-48-0; 123-86-4.. Pa-400r polyimide ancillary.. Palladium(ii) acetate.. 3375-31-3.. Palladium standard solution.. 7647-01-0; 7647-10-1; 7440-05-3.. Pbs phosphate buffered saline.. Pc 65 electrolyte.. 7758-99-8, 7664-93-9.. Pc electroless copper solution a.. 7732-18-5; 102-71-6.. Pc electroless copper solution b.. 7732-18-5; 67-56-1; 50-00-0.. Pc electroless copper solution c.. 7732-18-5; 7772-99-8; 7647-01-0.. Pc electroless copper solution d.. 7732-18-5; 7647-01-0; 7647-10-1.. Pcx 28-72 series.. 108-65-6; 78-93-3; 203008-78-0.. Pcx 30-20 series.. Pcx 30-27 series.. 108-67-8; 203008-78-0.. Pcx 30-46 series.. 108-67-8; 203008-78-0.. Pd523ad.. Pd-86-50 negative developer.. Pelco high performance nickel paste.. Pelco high temperatue carbon paste.. 7782-42-5; 344-28- 1; 1312-76-1.. Pepr 2400.. 7732-18-5; 111-13-7; 872-50-4.. Pepr 2400 photoresist.. Perfluoroheptane.. 335-57-9.. Pf-95 photomask fixer.. 7783-18-8; 64-19-7; 7757-83-7; 1004.. Pgmi sf series resist (organic polymer solution).. 120-92-3; 97-99-4; 102322-80-5.. Phenolphthalein.. 77-9-8.. Phenothiazine.. 92-84-2.. Phosphoric acid.. 7664-38-2.. Phosphorosilica film.. 141-78-6; 64-17-5; 67-56-1.. Phosphorus dopant coating pdc1-2000.. Photo-flo 200 solution.. 7732-18-5; 57-55-6; 9002-93-1.. Photoneece dl-1000.. 97-64-3; 96-48-0.. Photoneece pwdc-1000.. 96-48-0; 97-64-3.. Photoposit type p thinner.. Pi2771.. 872-50-4; 17831-71-9.. Pi5878g.. 872-50-4; 64742-95-6.. Piceatannol.. [10083-24-6].. Pirl iii.. Platinum etchant 1:1 part a.. Platinum etchant 1:1 part b.. Pmma std resist.. 108-90-7; 9011-14-7.. Poly (3,4-ethylenedioxythiophrene) // poly (styrenesulfonate).. 7732-18-5; 155090-83-8.. Poly(4-vinylphenol).. 24979-70-2.. Poly (4-vinylphenol), average mw ca.. Polyacrylic acid 25% solids in water.. Polybead styrene 25 micron microspheres.. 7732-18-5; 9003-53-6.. Polycaprolactone.. 24980-41-4.. Polydimethylsiloxane.. 9016-00-6.. Poly(d,l-lactide) ester terminated.. 26680-10-4.. Poly (ethylene glycol) acrylate.. 9051-31-4.. Poly(ethylene glycol) diacrylate.. 26570-48-9.. Poly(ethylene glycol) dimethacrylate.. 25852-47-5.. Poly(ethylene glycol) dimethacrylate 875.. Polyethylene glycol-(silane)2.. Polyethyleneimine.. Polyethylenimine.. 9002-98-6; 7732-18-5.. Polyisoprene.. 104389-31-3.. Poly-l-lysine hydrobromide.. 25988-63-0.. Polymersolution for nanoimprint lithography mr-i 7000 series.. Polymersolution for nanoimprint lithography mr-i 9000 series.. Polymethyl methacrylate.. 9011-14-7.. Poly [(methyl methacrylate) - co- ( disperse red 1 methacrylate)].. Polypropylene carbonate.. 25511-85-7.. Polystyrene.. 9003-53-6.. Polystyrene-block-polyisoprene-blockpolystyrene.. 25038-32-8.. Polyvinyl alchohol.. 9002-89-5; 67-56-1.. Polyvinylpyrrolidone.. 9003-39-8.. Potassium aurocyanide.. 13967-50-5.. Potassium aurocyanide, lead acetate solution.. 13967-50-5; 301-04-2.. Potassium carbonate anhydrous.. 584-08-7.. Potassium cyanide.. 151-50-8.. Potassium dichromate.. 7778-50-9.. Potassium ferricyanide.. 13746-66-2.. Potassium fluoride aqueous solution.. 7732-18-5; 7789-23-3.. Potassium hydroxide.. Potassium hydroxide pellets.. Potassium iodide.. 7681-11-0.. Potassium permanganate.. 7722-64-7.. Powder dam chemical absorbent.. Pr1-2000a positive resist.. 107-98-2; 1563-01-3.. Pr1-4000a.. 107-98-2; 1569-01-3.. Propane.. 74-98-6.. Propylene glycol methyl ether acetate.. Protek b3-25.. 763-69-9; 110-12-3.. Protek b3 primer.. Pse-300 s//f.. 107-15-3; 120-80-9.. Psr-4000bn clear.. 112-15-2; 34950-94-8.. Purolyte a2 series.. Pyralin hd4012xb.. 67-56-1; 127-19-5; 6837-24-7.. Pyralin pi2525.. 872-50-4; 31942-21-9.. Pyralin pi2540.. 872-50-4; 25038-81-7; 64742-95-6.. Pyralin pi2545.. Pyralin pi2555.. 872-50-4; 31942-21-9; 64742-95-6.. Pyralin pi2556.. Pyralin pi2610.. 872-50-4; 29319-22-0.. Pyralin pi2611.. Pyralin pi2613.. Pyralin pi2721.. Pyralin pi2731.. Pyralin pi2733.. Pyralin pi2734.. Pyralin pi2735.. Pyralin pi2808.. 872-50-4; 25038-81-7.. Pyralin t9039.. Pyrene.. 129-00-0.. Pyridine.. 110-86-1.. Pzt9103.. Qz 3322.. 141-43-5; 97-99-4.. Qz 3501 polyimide developer.. Qz 3512 polymide rinse.. Rd6 resist developer.. Remover pg photoresist remover.. Renshape sl 5510.. Resist remover rr41.. Resist remover rr5.. R//flex 3000 series lcp films.. Rhodorsil photoinitiator 2074.. 178233-72-2.. Rinse t1100.. 108-67-8, 95-63-6.. Riston fx515 photopolymer film.. 67-64-1; 87-67-1; 67-56-1.. Rottlerin.. [82-08-6].. Rr2 resist remover.. 67-68-58; 7732-18-8.. Rr3 resist remover.. Rr4 resist remover.. 67-68-58.. Salicylic acid.. 69-72-7.. Semicosil 936uv.. 37697-65-7; 13952-84-6.. Silane.. 7803-62-5.. Silane-nitrogen mixture.. Silicone elastomer base.. EXP: 2008.. Silicone oil.. 63148-62-9.. Silicone potting compound.. 68083-19-2; 68584-83-8.. Silicon tetrachloride.. 10026-04-7.. Siloxane polymer solution.. 3390-61-2; 107-98-4.. Silver.. 7440-22-4.. Silver etchant type tfs.. Silver nitrate.. 7761-88-8.. Sm-30 colloidal silica.. Sml300 series resist.. Sodium acetate.. 127-09-3.. 6131-90-4.. Sodium bicarbonate.. 144-55-8.. Sodium borohydride.. Sodium carbonate.. 497-19-8.. Sodium chloride.. 7647-14-5.. Sodium citrate.. 6132-4-3.. Sodium citrate, tribasic dihydrate.. 6132-04-3.. Sodium hydroxide.. 1310-73-2.. Sodium hypophosphite.. 10039-56-2.. Sodium n-dodecyl sulfate.. 151-21-3.. Sodium periodate.. 7790-28-5.. Sodium persulfate.. 7775-27-1.. Sodium phosphate monobasic monohydrate.. 10049-21-5.. Sodium saccharin.. 82385-42-0.. Sodium tungstate dihydrate.. 10213-10-2.. Solder mask hardener.. Solderon acid.. Solderon lead concentrate.. Solderon sc primary.. Solderon sc secondary.. Solderon tin concentrate.. Spr 955.. 97-64-3; 100-66-3; 628-63-7.. Stannous chloride dihydrate.. 7772-99-8.. Str 1075 photoresist.. 97-64-3; 123-86-4; 1330-20-7.. Strip aid solvent.. Su-8 100 series resist.. 28906-96-9; 96-48-0; 71449-78-0; 108-32-7; 89452-37-9.. Su-8 2000 series resists.. 120-92-3; 28906-96-9.. Su-8 3005 series resist.. Sulfamic acid.. 5329-14-6.. Sulfur hexafluoride.. 2551-62-4.. Sulfuric acid.. Sumiresin excel crc-8650.. Sumiresist neb-22a5//b8.. Summa-clean(r) sc-15m.. 7732-18-5; 62-49-7.. Surpass 3000.. [7732-18-5], [67-63-0].. Sylgard 184.. Sylgard 184 curing agent.. Sylgard 184 silicone elastomer.. 68988-89-6; 68083-19-2; 3555-47-3.. T1100.. T2490.. 102448-47-1.. T2492.. 78560-45-9.. Tantalum etch iii.. 7732-18-5; 7697-37-2; 7664-39-3.. Technic cu 2800 brightener.. Technic cu 2800 carrier.. Techni-gold 25 es rtu.. 7757-83-7; 19153-98-1.. Techni matte tin 89 rtu.. 7664-93-9; 7488-55-3.. Techni nf 820 hs make up.. Techni nf 820 hs rtu 60//40.. 53408-94-9; 17570-76-2; 75-75-2.. Techni nf 820 hs secondary additive.. 57-55-6.. Techni pc 75 brightener.. Techni pc 75 carrier.. Techni solder matte nf 820 60/40 rtu.. Technistan ag acid.. 75-75-2.. Technistan ag brightener.. 75-75-2, 10043-01-3.. Technistan ag make up.. 75-75-2, 79-19-6.. Technistan ag silver concentrate.. 2386-52-9, 75-75-2.. Technistan ag tin concentrate.. 53408-94-9, 75-75-2.. Teflon af.. 86508-42-1; 37626-13-4.. Terbium.. 7440-27-9.. Tert-butyl acrylate.. 1663-39-4.. Tetrafluoroboric acid.. 16872-11-0.. Tetrafluoromethane.. 75-73-0.. Tetrafluoromethane-oxygen mixture.. 75-73-0; 7782-44-7.. Tetrahydrofuran.. 109-99-9.. Tetralin (1,2,3,4-tetrahydronaphthalene).. 119-64-2.. Tetramethylammonium hydroxide 25%.. Tetramethylammonium hydroxide, 25% aqueous solution.. Tin (ii) oxide.. 21651-19-4.. Tin oxide etchant te-100.. Titanium diisopropoxide.. 17927-72-9; 67-63-0.. Titanium diisopropoxide bis(2,4-pentanedionate).. 17927-72-9.. Titanium etchant.. Titanium etchant tftn.. 7732-18-5; 7647-01-0.. Titanium nitride etch 22-7.. 7664-39-3, 7637-97-2, 7732-18-5.. Ti-tungsten etchant tiw-30.. Tm-40 colloidal silica.. Toluene.. 108-88-3.. Trichloroethylene.. 79-01-6.. (tridecafluoro-1,1,2,2-tetrahydrooctyl) -1-dimethylchlorosilane.. Triethylamine.. 121-44-8.. Trifluoromethane.. 75-46-7.. Trifluoromethanesulfonic acid.. 1493-13-6.. Trimethylol propane triacrylate.. 15625-89-5.. Tris(tert-butoxy)silanol.. 18166-43-3.. Tritolyl phosphate.. 215-548-8.. Triton x-100.. 9002-93-1.. Triton x-15.. 9036-19-5.. Triton x-45.. Tungsten etchant tfw, chromium cermet etchant-tfe.. 13746-66-2; 1310-58-3.. Tween 20.. 9005-64-5.. Tyrphostin ag879.. [148741-30-4].. Ufc 170a.. 947-19-3.. Ultradel 7501.. Ultradel a600 adhesion promoter.. Ultradel d760 developer.. 872-50-4; 96-48-0.. Ultrafill a-2001 accelerator.. 7732-18-5; 7758-98-77664-93-9.. Ultrafill s-2001 suppressor.. Ultra strip 6600.. 141-43-5; 107-15-3.. Unity 2203p.. Unity 4678e.. Unity sacrificial polymers.. Uv6-0.. 7 duv photoresist.. Uv - 69.. 100-42-5.. Vm651.. Vm652.. Wafer grip adhesive film.. Wellomer uv4050.. Wl-53-50 photopatternable spin-on silicone.. 108-67-8; 68037-59-2; 3555-47-3.. Wl-5351 photopatternable spin-on silicone.. Wl-9653 silicone film developer dev sample.. 8054-41-3.. Xenon difluoride.. 130709-36-9.. Xp-0899.. 108-65-6; 64-17-5.. Xp-3636 opto developer.. 7732-18-5; 1310-73-2.. Xp-3637 opto core.. Xp su-8 2000 series photoresist.. 96-48-0; 28906-96-9.. Xp su-8 developer.. Xp su-8 series photoresist.. Xr-1541 e-beam resist.. Zap1010-1020 adhesion promoter.. Zdmac.. 127-19-5.. Zed-500.. 96-22-0; 105-53-3.. Zed-n50.. Zep-520a.. 100-66-3; lve l-91-134.. Zep 7000a-14.. Zep-rd.. 1330-20-7.. Zirconium n-propoxide 70% in n-propanol.. 23519-77-9, 71-23-8.. Zmd-d.. 108-10-1;.. Zp4951 fluorinated polyether copolymer.. Zpn 2464-27 resist.. 108-65-6; 24979-70-2..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Filling out this form is the best way to contact us with any questions.. If necessary, we will do our best to respond to your comment or question within 1 to 2 business days.. If you are already a user and in need of service, please fill out a.. service request.. First name:.. Last name:.. Email:.. Not required, but we can only contact you if you provide us an email address.. Reason:.. ---------.. Training.. CMOS Fab Run.. Dicing.. Maskshop.. Other.. Comment or Question:.. Is internal:.. Unknown.. Yes.. No.. Indicate whether user is internal (GT) or external.. Pettit Building.. Phone.. Front Office.. 404-894-5100.. Cleanroom Operations Staff Office.. 404-894-3447.. 404-894-5036.. Cleanroom Operations Staff Offices.. 404-385-0057 or 404-385-0058.. Cleanroom Facilities Staff Office.. 404-385-0002.. Inorganic Cleanroom.. 404-385-0056.. Organic Cleanroom.. 404-894-2367 - Room 1253 (Gowning Room).. 404-894-2389 - Room 1262A.. 404-894-2395 - Room 1262B.. 404-894-2414 - Room 1261.. 404-894-2437 - Room 1263.. 404-894-2456 - Room 1265.. 404-894-2475 - Room 1266.. 404-894-2476 - Room 1267.. 404-894-2551 - Room 1268.. Other Contacts.. Email.. Title.. Gary Spinner.. gary.. spinner@ien.. edu.. Cleanroom Manager.. Office: 404-894-4010.. Home: 404-391-9182..  ...   Engineering Domain Expert.. Office: 404-894-0479.. Home: 404-955-9733.. Cell: 404-955-9733.. Todd Walters.. todd@gatech.. Research Engineer.. Office: 404-894-0935.. Home: 404-895-9723.. Cell: 404-895-9723.. Chris Yang.. chris.. yang@gatech.. Process Engineer.. Office:.. Home: 404-375-6632.. Cell: 404-375-6632.. Hang Chen.. hc64@mail.. Home: 404-751-6596.. Cell: 404-751-6596.. Paul Joseph.. pj40@prism.. Biomedical Engineering Research Coordinator.. Office: 404-894-9423.. Home: 678-796-3606.. Cell: 678-796-3606.. Eric Woods.. eric.. woods@ien.. Metrology Engineer.. Home: 404-312-0096.. Cell: 404-312-0096.. Jason Herrington.. jason.. herrington@ien.. Electrical Engineer II.. Office: 404-894-1293.. Home: 404-894-1293.. Cell: 404-894-1293.. Mikkel Thomas.. mikkel.. thomas@ien.. Senior Process Engineer.. Office: 404-385-8536.. Cell: 404-408-8089.. Robert Rose.. bobrose@gatech.. Facility Manager.. Office: 404-894-9405.. Home: 404-391-1110.. Cell: 404-391-1110.. Dean Sutter.. ds170@mail.. Research Equipment Specialist.. Office: 404-385-3899.. Home: 404-391-4059.. Cell: 404-391-4059.. Ben Hollerbach.. ben.. hollerbach@nrc.. Design Engineer.. Cell: 404-385-0058.. Walter Henderson.. walter.. henderson@ece.. Research Scientist: X-ray and scanning probe systems.. Office: 404-894-4702.. Home: 404-309-8023.. Cell: 404-309-8023.. Jie Xu.. jie.. xu@gtri.. Senior Research Scientist.. Office: 404-407-6122.. Home: 404-234-8413.. Cell: 404-234-8413.. Thomas Johnson-Averette.. tjohnson8@gatech.. Electrical Engineer I.. Office: 404-971-8594.. Cell: 404-971-8594.. Neil Yim.. neil.. yim@ien.. Software Engr.. Office: 404-894-2724.. View.. Georgia Tech - NRC and MiRC.. in a larger map |.. Directions from Airport..

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  • Title: Georgia Tech | Cleanroom
    Descriptive info: Open to Everyone.. Anyone in the world can come use the cleanrooms and labs.. Whether you already belong to the GT community or are a non-GT affiliated user, there are only a few simple steps to join.. Pay as You Go.. Our.. rates.. are designed to provide the most flexibility for our users.. You only pay when you use our facilities and equipment.. So if you use our labs one month, but not the next, you will only be charged for the month that you had activity.. Sign-up below to become a user.. There is no obligation and you will not be charged until you actually begin using our equipment or cleanrooms.. External Users.. If you have no affiliation with Georgia Tech, you are an external user.. This includes non-GT academic institutions, government labs, and industry users.. If you are from an academic institution or government institution, you pay the same.. as Georgia Tech users.. To join our community, please fill out.. this form.. and fax it to 404-385-4082, with attention to Charlie Turgeon.. Once we have received and processed this form, you will receive further instructions from our staff.. Orientation.. As of January 1, 2012, all new users of the Pettit, Marcus Inorganic, and Marcus Organic Cleanrooms & Labs are required to attend a common orientation program.. This training will cover policies and procedures, safety, ethical practices, and basic processing.. After attending this orientation, users can be granted access to all IEN facilities.. You are required sign up for orientation while registering below.. Time.. 16, 2014, 8:30 a.. m.. to 4:30 p.. Pettit 102 A/B.. 30, 2014, 8:30 a.. Oct.. 14, 2014, 8:30 a.. 28, 2014, 8:30 a.. 11, 2014, 8:30 a.. 25, 2014, 8:30 a.. Dec.. 9, 2014, 8:30 a.. Already Have a GT Username?.. If you are part of the GT community, you already have a GT username.. If you are not yet part of the GT community (i.. e.. , you are an external user), see the.. external users.. section for further instructions.. Cleanrooms & Labs.. Fill out the form below.. You must select an orientation session to register.. Your PI can now approve you to use any of our cleanrooms or labs.. After orientation, take three online exams: the Cleanroom Entrance Exam, the Chemical Safety Exam, and the Fume Hood Exam.. Start getting trained on cleanroom equipment.. Register.. * Denotes required field.. *GT Username.. *GT PI / IEN HOST.. Abdel-Khalik, Said (abdel-khalik792).. Abdolvand, Reza (gtg575e).. Abercrombie, Matthew (abercrombie530).. Adibi, Ali (aa23) - Ali Adibi s Project.. Adibi, Ali (aa23) - Sinoora Inc.. Aidun, Cyrus (ca17).. Alamgir, Faisal (falamgir3).. Allen, Mark (ma20) - Axion Biosystems.. Allen, Mark (ma20) - Cardiomems.. Allen, Mark (ma20) - Clark.. Allen, Mark (ma20) - Mark Allen s Project.. Allen, Tatiana (tallen36).. Antoniou, Antonia (aantoniou6).. Averett, Rodney D (ra80) - Rodney Averett s Project.. Ayazi, Farrokh (fa29) - Farrokh Ayazi (Qualtre).. Ayazi, Farrokh (fa29) - Farrokh Ayazi s Project.. Babensee, Julia (jb420).. Bakir, Muhannad (mb273) - Bakir (NNIN).. Bakir, Muhannad (mb273) - Muhannad Bakir s Project.. Baldwin, Daniel (db127).. Bao, Gang (gb61).. Barabino, Gilda (gb94).. Barker, Thomas (tbarker3).. Bassiri-Gharb, Nazanin (nbg3).. Bean, Jeff (jeffbean).. Beck, Thomas (tbeck3).. Behrens, Sven (sbehrens3).. Bellamkonda, Ravi (rb276).. Bergin, Michael (mb259) - Bergin s Project.. Bergin, Michael (mb259) - Bergin XPS Project.. Berthelot, Yves (yb3).. Bhatti, Pamela (pbhatti3).. Bidstrup, Sue Ann (bidstrup798).. Black, William (wb22).. Book, Gregory (gb104) - AMO.. Book, Gregory (gb104) - Axion.. Book, Gregory (gb104) - Clemson.. Book, Gregory (gb104) - Clemson 2.. Book, Gregory (gb104) - Covenant College.. Book, Gregory (gb104) - Covenant College (Academic).. Book, Gregory (gb104) - Coveytech.. Book, Gregory (gb104).. Book, Gregory (gb104) - Duke.. Book, Gregory (gb104) - FIU.. Book, Gregory (gb104) - Greg Book (Clemson.. Book, Gregory (gb104) - Gregory Book (Cvinc).. Book, Gregory (gb104) - GT Lorraine - Adallah Ougazzaden.. Book, Gregory (gb104) - GWU- Ou.. Book, Gregory (gb104) - Helios.. Book, Gregory (gb104) - Houghton Metal Finishing (Industry).. Book, Gregory (gb104) - HUST.. Book, Gregory (gb104) - Intel-Index.. Book, Gregory (gb104) - Koc Univ.. Book, Gregory (gb104) - L3.. Book, Gregory (gb104) - L-3.. Book, Gregory (gb104) - LSU.. Book, Gregory (gb104) - MVA Scientific.. Book, Gregory (gb104) - NCSU Project.. Book, Gregory (gb104) - NNIN-LEF.. Book, Gregory (gb104) - OpenCell.. Book, Gregory (gb104) - Oracle.. Book, Gregory (gb104) - Peking University.. Book, Gregory (gb104) - Pretoria.. Book, Gregory (gb104) - Qualtre.. Book, Gregory (gb104) - St Judes Medical.. Book, Gregory (gb104) - Supervisor.. Book, Gregory (gb104) - SURE.. Book, Gregory (gb104) - TDK.. Book, Gregory (gb104) - Tim Lian s Project.. Book, Gregory (gb104) - UCF.. Book, Gregory (gb104) - UGA-Chem.. Book, Gregory (gb104) - UGA - Physics.. Book, Gregory (gb104) - U Michigan.. Book, Gregory (gb104) - Univ Delaware - Honsberg.. Book, Gregory (gb104) - University of Florida.. Book, Gregory (gb104) - UofT.. Book, Gregory (gb104) - UofT - English.. Book, Gregory (gb104) - U Tulsa - Hari.. Book, Gregory (gb104) - Vanderbilt - Greg.. Book, Gregory (gb104) - ViscidTech.. Book, Gregory (gb104) - Zurvahn (Industry).. Book, Wayne (wb26).. Botchwey, Edward A (ebotchwey8) - Edward Botchwey s Project.. Bottomley, Lawrence (lb18).. Boyan, Barbara (bb196).. Brand, Oliver (ob11).. Breedveld, Victor (vb54).. Brown, April (brown804).. Brown, Billyde (bbrown83) - Billyde Brown s Project.. Brown, Devin (db63).. Brown, Devin (db63) - Lorelle Pye UCF.. Brown, Devin (db63) - Vanderbilt University.. Brown, Kenneth (kbrown31).. Bucknall, David (db297).. Bunz, Uwe H.. F.. (ub7).. Burns, Susan (sb367).. Butera, Robert J (rb65).. Cai, Wenshan (wenshancai).. Caravati, Kevin (kc163).. Carr, Wallace (wc3).. Carter, Brent (wc19).. Chaikof, Elliott (ec106).. Chambers, Jana (jc97).. Champion, Julie (jchampion7).. Chang, Gee-Kung (gc89).. Chatterjee, Abhijit (ac42).. Chen, Yongsheng (ychen365).. Cherkaoui, Mohammed (mc331).. Citrin, David (dc187).. Cobb, Kim (kc182).. Cola, Baratunde (bcola3).. Colton, Jonathan (jc3).. Conrad, Ed (ec23).. Conrad, Leyla Sutcu (ls39) - 2106ART, Leyla Conrad SURE.. Cook, Kevin (kc164).. Cressler, John (jc481).. Creyts, Don (dc162).. Crittenden, John (jcrittenden3).. Curtis, Jennifer (jcurtis6).. Danyluk, Steven (sd20).. Das, Suman (sdas34).. Davidovic, Dragomir (dd121).. Davis, Jeffrey A (jd87).. Davis, Michael (mdavis41).. Dawson, Michelle (mdawson9).. Degertekin, Levent (ld71).. Deheer, Walt (wd42).. Deo, Chaitanya Suresh (cdeo3).. Deweerth, Steve (sd17).. Dickson, Robert (rd77).. Dixon, James Brandon (jdixon32).. Doolittle, Alan (wd27).. Dufek, Josef D (jdufek3).. Dupuis, Russell (rd132).. Edwards III, Mercer Boyd (medwards6) - Architectural Rapid Prototyping.. El-Sayed, Mostafa (me29).. Erbil, Ahmed (ae2).. Ethier, Christopher Ross (rethier3) - Ross Ethier s Project.. Fahrni, Christoph (cf77).. Fedorov, Andrei (af79).. Ferguson, Ian (sl61).. Fernandez, Facundo (ff24).. Fernandez-Nieves, Alberto (afn3).. Filler, Michael (mfiller3).. Finn, M.. G.. (mfinn6).. First, Phillip (pf17).. Forest, Craig (cf76).. Fraley, James (jf148).. Frazier, Bruno (af77).. Fuller, Tom (tf74).. Gall, Kenneth (kg118).. Garcia, Andres (ag120).. Garimella, Srinivas (sg183).. Garmestani, Hamid (hg41).. Gaylord, Tom (tg6).. Gerhardt, Rosario (rg25).. Ghiaasiaan, Seyed (sg25).. Gleason, Rudy (rg1002).. Gleason, Rudy (rg1002) - Gleason, Rudy-Cormatrix.. Glezer, Ari (ag33).. Gokhale, Arun (ag11).. Gole, James (jg42).. Gottfried, David (dg122) - Applied Biosystems.. Gottfried, David (dg122) - Axion Biosystems.. Gottfried, David (dg122) - CardioMEMS-Park.. Gottfried, David (dg122) - Clark Atlanta - 13066U6.. Gottfried, David  ...   (mm348) - Mohammad Mahmud s Project.. Mahmud, Mohammad (mm348) - Satish Kumar Project (REMOVE THIS).. Marchenkov, Alexei (am245).. Marder, Seth (sm306).. Martin, Kevin (kmartin) - ?.. Martin, Kevin (kmartin) - CMOS.. Martin, Kevin (kmartin) - CNT TIMs.. Martin, Kevin (kmartin) - Duke Ion Trap.. Martin, Kevin (kmartin) - El-Sayed LEO Access.. Martin, Kevin (kmartin) - Emory - Beth White.. Martin, Kevin (kmartin) - GSU.. Martin, Kevin (kmartin) - IFC.. Martin, Kevin (kmartin) - Kevin Martin Bud Peterson Project.. Martin, Kevin (kmartin) - Kevin Martin - Meindl.. Martin, Kevin (kmartin) - Kevin Martin s Project.. Martin, Kevin (kmartin) - Martin - Leo.. Martin, Kevin (kmartin) - NGIMAT.. Martin, Kevin (kmartin) - NNIN.. Martin, Kevin (kmartin) - Qcept.. Martin, Kevin (kmartin) - TAG.. Martin, Kevin (kmartin) - University of New Mexico.. May, Gary (gm32) - Gary May s Project.. May, Gary (gm32) - Gary May - SURE.. Mayor, Rhett (jmayor3).. Mcdevitt, Todd (tm187).. McDonald, John (jm566).. Mcdowell, David (dm27).. Meadors, John (jm15).. Meindl, James (jm118).. Melkote, Shreyes (sm107).. Mello, Michael (mmello8) - Michael Mello s Project.. Mercer, Allison J (am305) - Ramora.. Meredith, Carson (jm396).. Merrill, Alfred H (am264) - Alfred Merrill s Project.. Michielsen, Stephen (sm118).. Milor, Linda (lm147).. Mizaikoff, Boris (bm130).. Muhlstein, Christopher Lado (cm81) - Chris Muhlstein.. Murali, Raghunath (rm206) - Cleanroom Staff.. Murali, Raghunath (rm206) - INDEX Graphene.. Murali, Raghunath (rm206) - Scandisk - Coupon Pa.. Murthy, Niren (nm89).. Nadler, Jason (jn124).. Naeemi, Azad (an42).. Nair, Sankar (sn73).. Narayan, Roger (narayan860).. Neu, Richard (rn27).. Nguyen, Tran-Vinh (tn42) - Nguyen Tran-Vinh.. Nie, Shuming (sn4).. Obaid, Ramzy (ro29).. Orlando, Thomas (to23).. Palma, Diana (dp158) - Meindl Students.. Palma, Diana (dp158) - NNIN REU.. Palma, Diana (dp158) - Palma.. Papapolymerou, John (ip12).. Parnell, Nicholas Francis (np93) - PRL.. Payne, Christine (cpayne3).. Pennell, Kurt (kp48).. Perry, Joseph (jp322).. Peterson, G.. P.. (gpeterson7).. Pham, John (gtg928x).. Pierron, Olivier (opierron3).. Pollard, Kimsey (kp9).. Prausnitz, Mark (mp71).. Qi, Jerry (hqi32).. Qin, Dong (dqin7).. Qu, Jianmin (jq2).. Ragauskas, Arthur (ar31).. Ralph, Steve (sr108).. Ready, Jud (wr35).. Reichmanis, Elsa (ereichmanis3).. Reynolds, John Robert (jreynolds43) - John Reynolds.. Riedo, Elisa (er89).. Rohatgi, Ajeet (ar2).. Rose, Robert (rr41) - Cirrex.. Rose, Robert (rr41) - Erie.. Rose, Robert (rr41) - Luxcore.. Rose, Robert (rr41) - Microcoating.. Rose, Robert (rr41) - Quantira.. Rose, Robert (rr41) - Redeon.. Rose, Robert (rr41) - Robert Rose s Project.. Rosen, David (dr35).. Rotoloni, Bo (fr40).. Rousseau, Ronald W (rr21).. Roy, Krishnendu (kroy31) - Usage of Zetasizer SEM.. Russo, Paul Stephen (prusso6) - Paul Russo s Project.. Ruzzene, Massimo (mr188).. Sandhage, Kenneth (ks236).. Santamarina, Juan Carlos (js245).. Santangelo, Philip J (ps131) - Dynamic Light Scattering Experiments.. Schatz, Michael (ms201).. Schuster, Gary (gs48).. Shen, Shyh-Chiang (ss473).. Shi, Jianjun Jan (jshi33).. Shofner, Meisha (ms506).. Sievers, Carsten (csievers3) - Chemical Biomolecular Engineering.. Singh, Preet (ps68).. Sitaraman, Suresh (ss130).. Speyer, Robert (rs78).. Spinner, Gary (gs59) - Cleanroom Staff.. Spinner, Gary (gs59) - Gary Spinner s Project.. Spinner, Gary (gs59) - Hitachi 4700 FE SEM Only.. Spinner, Gary (gs59) - Spinner LEO.. Srinivasarao, Mohan (ms308) - Mohan Srin s project.. Stollberg, David (ds351).. Sturm, Terry (ts18).. Sulchek, Todd (tsulchek4).. Summers, Chris (cs2).. Sundaram, Venky (vs24).. Sutter Sr.. , Dean (ds120).. Taillefert, Martial (mt116).. Taite, Lakeshia J.. (ltaite3).. Tang, Xiangyang (xtang44).. Tang, Yuanzhi (ytang86).. Tannenbaum, Rina (rt85).. Tentzeris, Emmanouil (et35).. Thadhani, Naresh (nt6).. Thomas, Mikkel (gt0465b) - BridgeSemi.. Thomas, Mikkel (gt0465b) - Clemson - Nitride Membrane.. Thomas, Mikkel (gt0465b) - Clemson University-Zhao.. Thomas, Mikkel (gt0465b) - Excellatron.. Thomas, Mikkel (gt0465b) - Fisk University.. Thomas, Mikkel (gt0465b) - Georgia Southern - Wu.. Thomas, Mikkel (gt0465b) - GTRI.. Thomas, Mikkel (gt0465b) - Harper Labs.. Thomas, Mikkel (gt0465b) - Medshape.. Thomas, Mikkel (gt0465b) - Memtronics.. Thomas, Mikkel (gt0465b) - MIT - Boyden.. Thomas, Mikkel (gt0465b) - Morehouse - Rockward.. Thomas, Mikkel (gt0465b) - OpenCell.. Thomas, Mikkel (gt0465b) - ORNL Project.. Thomas, Mikkel (gt0465b) - Salil Woolam.. Thomas, Mikkel (gt0465b) - Sensor Electronic Technology, Inc.. Thomas, Mikkel (gt0465b) - U Missouri Columbia.. Thomas, Mikkel (gt0465b) - UNCC - Shekar.. Thomas, Mikkel (gt0465b) - University of Rochester - Krauss.. Thomas, Mikkel (gt0465b) - Univ of Central FL - Bhatambrekar.. Thomas, Mikkel (gt0465b) - Vanderbilt-Janet.. Thomas, Mikkel (gt0465b) - Vanderbilt - Janet ex.. Thomas, Mikkel (gt0465b) - Voxtel.. Thomas, Susan Napier (sthomas68) - Susan Thomas s Project.. Tolbert, Laren (lt14).. Trebino, Rick (rt81).. Tsukruk, Vladimir (vtsukruk3).. Tummala, Rao (rt39) - Advanced Package Integration to Mangerize Medical Implants- Texas Instruments.. Tummala, Rao (rt39) - Rao Tummala s Project.. Turgeon, Charlie (ct87) - Charlie Turgeon s Project.. Turgeon, Charlie (ct87) - LTMT Lab - Organic CR Door Access (Not Billable).. Turgeon, Kristin (gs599).. Turgeon, Kristin (kt2) - Kristin s Temp Project.. Turgeon, Kristin (kt2) - Kristin s Tester Project With Ross.. Ume, Charles (iu2).. Vachtsevanos, George (gv5).. Vannberg, Fredrik O (fvannberg6).. Verber, Carl (verber879).. Vogel, Eric (evogel7).. Voss, Paul (pvoss3).. Wagner, Brent (bw24).. Walker II, Mitchell L.. R.. (mw289).. Wallace, Robert (rw19).. Walton, Krista (kwalton8).. Wang, Chris (cw39).. Wang, Hsu-Pin (hwang373).. Wang, Hua (hwang386) - Hua Wang s Project.. Wang, Yadong (yw46).. Wang, Yang (ywang93).. Wang, Zhong Lin (zw5).. Wong, C.. P.. (cw93).. Woods, Eric (ew71).. Xia, Shuman (sxia30).. Xia, Younan (yxia45).. Xu, Jie (xu284).. Yao, Dongang (dy30).. Ye, Wenjing (wy12).. Yee, Shannon (syee7).. Yoda, Minami (my14).. Yoganathan, Ajit (ay2).. Yoon, Young-sup (yyoon) - Young-sup Yoon s Project.. Yu, Min-Feng (myu63) - Min-Feng Yu.. Yushin, Gleb (gyushin3).. Zamir, Evan (ezamir3).. Zhang, Guigen (zhang885).. Zhang, John (jz16).. Zhang, Zhuomin (zz17).. Zhou, James (zhou91).. Zhu, Cheng (cz4).. If your PI does not have an account with the IEN and is not shown in the GT PI drop down box, please ask your PI to come to this page and fill out the become a new user form selecting Jason Herrington as their PI.. Once they have done this please email Jason Herrington at jason.. edu with the PI name.. Once a new project is created for your PI you may sign up to become a user selecting your PI.. Note the PI is only required to attend orientation if they are planning to use the equipment or cleanrooms themselves.. Once you take the orientation and the 3 entry tests your PI may authorize you to use labs or cleanrooms by logging into cleanroom.. ien.. edu, going to their dashboard and selecting PI Resources - Authorize Users.. *Orientation.. 2014-09-16 08:30:00 - Pettit 102 A/B.. 2014-09-30 08:30:00 - Pettit 102 A/B.. 2014-10-14 08:30:00 - Pettit 102 A/B.. 2014-10-28 08:30:00 - Pettit 102 A/B.. 2014-11-11 08:30:00 - Pettit 102 A/B.. 2014-11-25 08:30:00 - Pettit 102 A/B.. 2014-12-09 08:30:00 - Pettit 102 A/B.. *How did you hear about us?.. Brochure.. Cleanroom/lab tour.. Cleanroom staff.. Colleague.. Equipment vendor.. Existing lab/cleanroom user.. Georgia Tech website.. Google.. NNIN.. Online video.. I.. Poster.. *Discipline.. Chemistry.. Education Lab Use.. Electronics.. Geology.. Life Science.. Materials.. Medicine.. MEMS.. Optics.. Physics.. Process.. Staff.. Card number.. Cell phone number.. Cell phone provider.. 7-11 Speakout.. Alltel.. AT T.. Boost Mobile.. Cellular One.. Cricket.. MetroPCS.. Nextel.. Sprint PCS.. T-Mobile.. TracFone.. US Cellular.. Verizon.. Virgin Mobile USA..

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